| 摘要 |
PROBLEM TO BE SOLVED: To provide a polishing pad for semiconductor wafer that can stably polish a semiconductor wafer by preventing a polishing layer from floating from a supporting layer or the surface of the pad from being curved at the time of polishing the wafer. SOLUTION: After non-crosslinked 1,2-polybutadiene is kneaded by means of a heated kneader, the kneaded product is again kneaded by adding a crosslinking agent to the product and made to cause a crosslinking reaction for a prescribed period of time in a mold. Then the supporting layer is obtained by molding the crosslinked product. On the other hand, after 80 vol.% crosslinked 1,2-polybutadiene and 20 vol.% P-cyclodextrin are kneaded together by means of a heated kneader, the kneaded product is again kneaded by adding a crosslinking agent to the product and made to cause a crosslinking reaction for a prescribed period of time in a mold. Then the polishing layer is obtained by molding the crosslinked product. Thereafter, this polishing pad for semiconductor wafer is obtained by joining the supporting layer to the rear surface of the polishing layer by means of a double-coated adhesive tape. |
