| 摘要 |
PROBLEM TO BE SOLVED: To provide a method for manufacturing a multilayer printed wiring board which can make the surface of a thin film conductor layer uniform and clean, which improves the affinity of a thin film conductor layer to a photosensitive dry film by improving wettability of the surface of the conductor layer, which can form a rectangular plating resist brought into close contact with the conductor layer, and which can further form a conductor circuit having excellent connecting reliability in a rectangular section. SOLUTION: The method for manufacturing the multilayer printed wiring board comprises (1) a step of laminating the photosensitive dry film 18 on an interlayer resin insulating layer 102 formed with a thin film conductor layer 112, (2) a step of forming the plating resist 103 by exposing to and developing the film 18, and (3) a step of forming the conductor circuit 13 on a plating resist non-forming part. In the step (1) of the method, the surface of the layer 112 is dry etched, and then the film 18 is laminated. |
