| 摘要 |
PROBLEM TO BE SOLVED: To solve the problem that a plating liquid and the like enters a thick- film circuit on the lower surface of a ceramic wiring board through a division groove to cause corrosion, peeling, etc., at the thick-film circuit, when a metal plate layer is coated on a metalized wiring conductor on the upper surface. SOLUTION: Related to a ceramic wiring board 7, division grooves 3 are formed in all directions at least on the lower surface of a ceramic mother board 1. A metalized wiring conductor 2 on which a metal plate layer is coated is formed on the upper surface of a square region 1a partitioned with the division groove 3, while a thick-film circuit 5 coated with a resin layer 6 comprising organic resin is formed on the lower surface. The division groove 3 positioned outside the square region of the ceramic mother board 1 is coated with a coating material 4 which is obtained by sintering a ceramics paste. Thus, entering of plating liquid or the like into the thick-film circuit 5 from the division groove 3 is effectively prevented to discourage corrosion, peeling, etc., for reliability of the ceramic wiring board 7.
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