SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREFOR

摘要

PROBLEM TO BE SOLVED: To provide a semiconductor device wherein it is easy to apply solder to the end faces of the lead terminals thereof and a manufacturing method for a semiconductor device using a lead frame for the purpose. SOLUTION: The lead terminals 11a to 11h of the semiconductor device 100 have respectively notched faces 15a to 15h at the end faces 13a to 13h of exposed portions 12a to 12h thereof. The notched faces 15a to 15h are subject to plating for the enhancement of solder wettability.