WIRING SUBSTRATE, METHOD OF MANUFACTURING THE SAME, AND ELECTRONIC COMPONENT

摘要

PROBLEM TO BE SOLVED: To solve the problem wherein a bonding agent is crowed out from a conductive land when an electronic component mounted on the conductive land using a conductive bonding material having viscosity is reduced in size. SOLUTION: On the main surface of an insulation substrate 11, a wiring substrate 10 includes the conductive land 12 formed thicker in the peripheral area than the central area, and an electronic component 14 which is electrically mounted on the central area of the conductive land 12 via a conducive bonding material 15.