| 摘要 |
PROBLEM TO BE SOLVED: To make uniform a bonding condition between a bump of a semiconductor chip and an internal contact of a chip-mounted member. SOLUTION: In a semiconductor device, there are equipped with a semiconductor chip 10 provided with an Au bump 12 on the surface, and an internal electrode pad 21 on the chip mount surface 20a and on the other hand. A chip mount board 20 having an external electrode land 22 on the external connection surface 20b and the Au bump 12 of the semiconductor chip 10 is bonded on the internal electrode pad 21 of the chip mount board 20 in the state that the semiconductor chip 10 is reversed. An external electrode land 22 is so placed in such a region that corresponds to the region placed by the internal electrode pad 21 across the chip mount board 20. |
