APPARATUS AND METHOD FOR FORMATION OF THIN FILM

摘要

PROBLEM TO BE SOLVED: To form a thin-film pattern on a substrate by a simple and low-cost process. SOLUTION: A gel insulating film 21 is formed on the surface of a wafer 20. A metal-wiring-film pattern 32 is formed on a transfer member 30 arranged so as to face the wafer 20. The wafer 20 and the transfer member 30 are brought into close contact so as to be then separated. Thereby, the pattern 32 is transferred to the wafer 20 side. Since the insulating film 21 is gelled, the pattern 32 is set to a state that it is embedded in the insulating film 21.