Temperature/strain control of fatigue vulnerable devices used in electronic circuits

摘要

A temperature control system and method reduces thermal/strain fatigue failures in connections between first and second circuit elements of an electronic circuit. A temperature control device is in a heat exchange relationship with at least one of the first and second circuit elements. The temperature control device maintains a temperature of the first and second circuit elements below a predetermined high temperature and above a predetermined low temperature when the electronic circuit is operating and when the electronic circuit is not operating to reduce thermally-induced fatigue of the connection. The coefficients of thermal expansion (CTE) of the first and second circuit elements are also matched. The temperature control device includes a thermoelectric heat pump, a heat pipe, a finned heat exchanger, a phase change heat transfer device, a heat sink and/or any other suitable temperature control device.