| 摘要 |
PURPOSE: A substrate processing apparatus control system and a substrate processing apparatus are provided to be capable of effectively reflecting the inspection result of pre-processes and the measurement result of the thickness of a layer formed at the upper portion of a bare wafer. CONSTITUTION: A substrate processing apparatus control system is provided with a substrate processing apparatus(1), an exposure apparatus(2) and a controller(3). At this time, the substrate processing apparatus includes a plurality of processing units(12) and an inspecting unit(11). At this time, each processing unit is provided with a coating processing unit, a development processing unit, and a thermal annealing unit. At the time, the controller is used for controlling the inspecting unit, the processing unit, a reverse transfer robot, and a transfer robot. Preferably, each processing unit is used for carrying out a predetermined process at the upper portion of a substrate according to the condition setting result of each condition setting part(121).
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