BAKE APPARATUS FOR FABRICATING SEMICONDUCTOR DEVICE

摘要

PURPOSE: A bake apparatus for fabricating a semiconductor device is provided to exchange a heating plate within a short time by forming a plurality of bolt holes on the heat plates. CONSTITUTION: A bake apparatus is formed with a process chamber, a quartz chamber, a heating plate, and a support plate. The quartz chamber is loaded on an upper surface of the support plate within the process chamber. The heating plate is used for heating the inside of the process chamber. The heating plate is fixed on an inner wall of the process chamber by using bolts. A plurality of bolt holes(200) are formed on the heating plate. The bolt holes(200) are formed with the first hole(210) and the second hole(230). A path(220) is used for connecting the first hole(210) with the second hole(220).