| 摘要 |
PROBLEM TO BE SOLVED: To provide an epoxy resin molding material for sealing which can achieve flame retardance without containing a halogen or antimony and excels in reflow soldering resistance, and an electronic part device having an element sealed therewith. SOLUTION: The nonhalogen, nonantimony epoxy resin molding material for sealing comprises (A) an epoxy resin, (B) a curing agent, (C) a curing accelerator, and (D) an inorganic filler as the essential components, and has a storage elastic modulus at 260 deg.C of <=250 MPa. The electronic part device has an element sealed with this epoxy resin molding material for sealing.
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