IMPROVED COMPOSITIONS, METHODS AND DEVICES FOR HIGH TEMPERATURE LEAD-FREE SOLDER

摘要

A lead-free (130) solder comprises an alloy of silver and bismuth in amounts of about 2 wt% to about 18 wt% and about 98 wt% to about 82 wt%, respectively. Contemplated alloys further comprise at least one of zinc, nickel, germanium or a combination thereof in an amount of up to about 1000 ppmy and have a solidus of no lower than about 262.5 DEG C and a liquidus of no higher than about 400 DEG C. Contemplated alloys may further comprise a chemical element with an oxygen affinity that is higher than the oxygen affinity of at least one of the constituents of the alloy, and particularly contemplated elements are phosphorus and germanium.