Automatic detection, assessment of crystal grid displacements during photolithographic process involves checking data against tolerance band, evaluating systems causing band violations

摘要

The method involves automatically detecting internal wafer adjustment data for the exposure system in rear time immediately at the end of an exposure step, processing the data in real time with at least one algorithm in a computer, checking the data against a tolerance band, evaluating any production systems causing violation of the band boundaries and outputting a warning signal and/or automatically stopping production in the relevant systems. AN Independent claim is also included for the following: a computer for implementing the inventive method.