| 摘要 |
A heat sink, is made to have a decreased thermal resistance (sink to ambient heat dissipation) and increased heat transfer coefficient by reducing the thickness of the thermal boundary layer. The heat sink includes a thermally conductive base and a plurality of fins extending from a surface of the thermally conductive base. The fins are made of a thermally conductive mesh material. Alternatively, the heat sink can include a thermally conductive base and a plurality of pins extending perpendicularly from a surface of the thermally conductive base, the plurality of pins being made of a thermally conductive material, and being arranged in a plurality of rows, and a plurality of wires extending parallel to the thermally conductive base, each of the wires connecting the pins of one of the plurality of rows.
|
