| 摘要 |
The present invention relates to a reactive photo acid-generating agent and a heat-resistant photoresist composition comprising the same. In particularly, the present invention relates to the heat-resistant photoresist composition comprising the photo acid-generating agent expressed by the following formula (1), which can increase the degree of polymerization, and polyamide oligomers having acetal or its cyclized derivatives, which have an ability of that light-exposed area is dissolved in the developer and light-unexposed area is convertible to a heat-resistant polymer in the latter heating process and thus, it can be used for passivation layer, buffer coat or layer-insulating film of the multilayer printed circuit board, wherein and R are the same as defined in the detailed description of the Invention.
|
