发明名称 |
Chip package enabling increased input/output density |
摘要 |
A device and method for increasing input/output from a die by making electrically conductive microvias connecting the integrated circuit with a backside of the die. The backside electrically conductive microvias connect an integrated circuit in the die to pads on the backside of the die. A superstrate is situated on top of the die and connects to the microvias using controlled collapse chip connections (C4) with a thermal interface material (TIM) surrounding the electrical connections. A superstrate lead system electrically connects the backside pads to wirebonds that connect with either the substrate or directly to the motherboard. Heat dissipates from the die via the TIM to the superstrate to a heat sink situated on top of the superstate. |
申请公布号 |
US2003064584(A1) |
申请公布日期 |
2003.04.03 |
申请号 |
US20010967748 |
申请日期 |
2001.09.28 |
申请人 |
DUJARI PRATEEK;MONZON FRANKLIN;TADAYON POOYA |
发明人 |
DUJARI PRATEEK;MONZON FRANKLIN;TADAYON POOYA |
分类号 |
H01L23/48;H01L23/498;(IPC1-7):H01L21/44 |
主分类号 |
H01L23/48 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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