发明名称 |
METHOD AND APPARATUS FOR CONTROLLING CONTAMINATION DURING THE ELECTROPLATING DEPOSITION OF METALS ONTO A SEMICONDUCTOR WAFER SURFACE |
摘要 |
A method and apparatus for the electroplating deposition of a metal onto a semiconductor wafer surface (29), including vibrationally scrubbing the wafer surface (29) during an electroplating process. At least one transducer (32) is mounted to a wall (33) of an electroplating tool chamber (22). The transducer (32) intermittently delivers sonic energy pulses lasting for one to two seconds to the electroplating solution during the electroplating process.
|
申请公布号 |
US2003064586(A1) |
申请公布日期 |
2003.04.03 |
申请号 |
US20010965739 |
申请日期 |
2001.09.28 |
申请人 |
MERCHANT SAILESH MANSINH;OH MINSEOK;RAMAPPA DEEPAK A. |
发明人 |
MERCHANT SAILESH MANSINH;OH MINSEOK;RAMAPPA DEEPAK A. |
分类号 |
C25D5/20;C25D7/12;H01L21/288;(IPC1-7):C25D1/00;H01L21/76 |
主分类号 |
C25D5/20 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|