| 摘要 |
<p>Metallurgy structures (34a’-d’) for input/output pads (23a-d) of an electronic device can be adapted to receive both solder and wire bonds. First and second metallurgy structures, for example, can be provided on respective first and second input/output pads of an electronic device such that the first and second common metallurgy structures have a shared structure adapted to receive both solder and wire bonds. A solder bond can thus be applied to the first metallurgy structure, (346’, 34c’) and a wire bond can be applied to the second metallurgy structure (34a’, 34d’).</p> |
