MATERIAL FOR PRODUCING PRINTED WIRING BOARD AND ITS PRODUCTION METHOD

摘要

PROBLEM TO BE SOLVED: To provide a material for producing a printed wiring board which can reduce the thickness dispersion of the board and improve the productivity of the board. SOLUTION: A thermosetting resin layer 2 cured to a B-stage is formed at least on one side of a lengthy thermosetting resin substrate 1. Since a process of overlapping a lengthy circuit board and a heating/pressurization/molding process can be implemented continuously while being sent in the longitudinal direction, the productivity can be improved as compared with a batch method. The thickness dispersion of the printed wiring board can be reduced.