发明名称 COATING LIQUID FOR FORMING DIELECTRIC FILM OF PEROVSKITE STRUCTURE AND METHOD OF FORMING DIELECTRIC FILM OF PEROVSKITE STRUCTURE
摘要 PROBLEM TO BE SOLVED: To provide a coating liquid for forming a thin dielectric film of a perovskite structure which is capable of manufacturing a thin and dense oxide film of a large film thickness by one time of deposition and firing operation by a solution coating applying and firing process and a method of forming the dielectric film of the perovskite structure. SOLUTION: The coating liquid for forming the dielectric film of the perovskite structure prepared by incorporating a dielectric oxide component of the perovskite structure as a raw material of dielectric oxide of the perovskite structure in a solution essentially consisting of alcohol and incorporating 30 to 100 mass% hydroxypropyl cellulose in the dielectric oxide component of the perovskite structure and the method of forming the dielectric film of the perovskite structure using the same are provided.
申请公布号 JP2003096576(A) 申请公布日期 2003.04.03
申请号 JP20010291499 申请日期 2001.09.25
申请人 TDK CORP;KANSAI RESEARCH INSTITUTE 发明人 FUKUI TOSHIMI;TSUJI SEIJI;SON HITONORI;SHIRAKAWA YUKIHIKO;MIWA MASASHI
分类号 C23C20/00;C04B35/49;C04B35/491;C04B35/622;H01L41/187;H01L41/317;H01L41/39;H01L41/43 主分类号 C23C20/00
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