发明名称 |
COATING LIQUID FOR FORMING DIELECTRIC FILM OF PEROVSKITE STRUCTURE AND METHOD OF FORMING DIELECTRIC FILM OF PEROVSKITE STRUCTURE |
摘要 |
PROBLEM TO BE SOLVED: To provide a coating liquid for forming a thin dielectric film of a perovskite structure which is capable of manufacturing a thin and dense oxide film of a large film thickness by one time of deposition and firing operation by a solution coating applying and firing process and a method of forming the dielectric film of the perovskite structure. SOLUTION: The coating liquid for forming the dielectric film of the perovskite structure prepared by incorporating a dielectric oxide component of the perovskite structure as a raw material of dielectric oxide of the perovskite structure in a solution essentially consisting of alcohol and incorporating 30 to 100 mass% hydroxypropyl cellulose in the dielectric oxide component of the perovskite structure and the method of forming the dielectric film of the perovskite structure using the same are provided. |
申请公布号 |
JP2003096576(A) |
申请公布日期 |
2003.04.03 |
申请号 |
JP20010291499 |
申请日期 |
2001.09.25 |
申请人 |
TDK CORP;KANSAI RESEARCH INSTITUTE |
发明人 |
FUKUI TOSHIMI;TSUJI SEIJI;SON HITONORI;SHIRAKAWA YUKIHIKO;MIWA MASASHI |
分类号 |
C23C20/00;C04B35/49;C04B35/491;C04B35/622;H01L41/187;H01L41/317;H01L41/39;H01L41/43 |
主分类号 |
C23C20/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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