| 摘要 |
PROBLEM TO BE SOLVED: To provide an epoxy resin material for sealing, which is halogen-free and antimony-free, and has good flame retardancy without detriment to moldability, resistance to reflowing, moisture resistance, and reliability in e.g. characteristics when left to stand at a high temperature, and an electronic part device provided with an element sealed with the material. SOLUTION: The epoxy resin composition for sealing is characterized in that it comprises essentially (A) epoxy resins, (B) a curing agent, (C) a cure accelerator, (D) an inorganic filler and (E) a composite metal hydroxide and that the epoxy resins (A) include an epoxy resin containing sulfur atoms. The electronic part device is provided with an element sealed with the epoxy resin composition.
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