发明名称 Memory cell capacitor structure and method of formation
摘要 An improved dynamic random access memory (DRAM) device with a capacitor having reduced current leakage from the dielectric layer, and materials and methods for fabricating the improved DRAM device are disclosed. The capacitor is formed using an oxygen anneal after a top conducting layer of the capacitor is formed.
申请公布号 US2003062558(A1) 申请公布日期 2003.04.03
申请号 US20020281954 申请日期 2002.10.29
申请人 YANG SAM;GEALY DAN 发明人 YANG SAM;GEALY DAN
分类号 H01L21/02;H01L21/314;H01L27/108;(IPC1-7):H01L21/824;H01L29/76;H01L31/119 主分类号 H01L21/02
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