发明名称 Holding device for a bundle of laminations/armature stampings for forming a magnetic circuit has a base, a cover, several sides and metal plates inside the holding device gripping the bundle of laminations/armature stampings.
摘要 Multiple metal plates (5) inside a holding device grip a bundle (4) of laminations/armature stampings in an interlocking manner. For this purpose, single parts (1-3) have flange-type necks (6) along their edges. These necks are made to be riveted or screwed down. All this forms a stable box with non-metallic, non-conductive material reinforced with fiberglass.
申请公布号 DE10144104(A1) 申请公布日期 2003.04.03
申请号 DE20011044104 申请日期 2001.09.03
申请人 SIEMENS AG 发明人 BOHN, JOSEF
分类号 H01F27/245;H01F27/26;H02K5/08;(IPC1-7):H01F27/26;H01F3/10 主分类号 H01F27/245
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