发明名称 WATER-BASED HIGH SOLID THERMOSET RESIN COMPOSITION
摘要 PROBLEM TO BE SOLVED: To obtain a water-based high solid thermoset resin composition using a high solid emulsion resin suitable for a binder having thermosetting properties. SOLUTION: The water-based high solid thermoset resin composition comprises the high slid emulsion resin and a curing agent and has a viscosity of 30-10,000 mPa.s as measured by an E-type viscometer at 1 rpm (25 deg.C) and a solid content of 55-65 wt.%. The high-solid emulsion resin comprises two types of resin particles having different volume average particle sizes that are obtained by emulsion polymerization of anα,β-ethylenically unsaturated monomer mixture having a hydroxy value of 10-150 and an acid value of 5-50. The first resin particle has a larger volume average particle size compared with that of the second resin particle. The first resin particle has a volume average particle size of 0.2-1.5μm, and the second resin particle has a volume average particle size of 0.05-0.4μm.
申请公布号 JP2003096264(A) 申请公布日期 2003.04.03
申请号 JP20010293265 申请日期 2001.09.26
申请人 NIPPON PAINT CO LTD 发明人 HISAWATARI WAKANA;UMAGOE ATSUO;OSUGI KOJI
分类号 C08L57/00;C08F2/22;(IPC1-7):C08L57/00 主分类号 C08L57/00
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