| 摘要 |
<p>A thin film circuit board device having passive elements in a wiring layer comprises a base substrate (2) and a circuit section (3) with insulation layers (11) (16) pattern wirings (14) (17) formed on a build-up face (2a), and a receiving electrode section (21) on the first insulation layer (11), and with a passive element electrically connected to the receiving electrode section (21). The circuit section (3) comprises a substrate layer (23) and substrate titanium layer (22) formed by so stacking a substrate titanium film and substrate film as to coat the receiving electrode section (21) and each passive element, and by etching the substrate film and substrate titanium film in a region free of the metal film with a mask of a metal film of the first pattern wiring (14) formed on the substrate film. Thus, the substrate titanium film serving as the substrate titanium layer (22) prevents the receiving electrode section and each passive element from being corroded by an etchant, so that a high-performance passive element is constituted.</p> |
