PROGRAMMABLE CHIP-TO-SUBSTRATE INTERCONNECT STRUCTURE AND DEVICE AND METHOD OF FORMING SAME

摘要

A structure and system for forming an electrical interconnection between a microelectronic device and a substrate and a method of forming the interconnection are disclosed. The interconnection includes a first electrode formed on the microelectronic device, a second electrode formed on the substrate, and an ion conductor placed between the first and second electrodes. An electrical connection between the microelectronic device and the substrate is formed by applying a bias across the first and second electrodes to form a conductive region within the ion conductor.