发明名称 HEAT INSULATING DOOR DEVICE
摘要 <p>PROBLEM TO BE SOLVED: To reduce a construction cost and a repair cost by dispensing with cutting of a resin frame or a transom in either case of a heat insulating door device with or without the transom. SOLUTION: In this heat insulating door device, a door frame body F is constituted by connecting a resin frame P to the indoor side of a metal frame M, and a heat insulating door D is accommodated in the metal frame and supported in an openable/closable manner. A vertical frame 22 of the resin frame is dividedly composed of an outer frame 22o stuck to the indoor side part of the vertical frame of the metal frame, and an inner frame 22i connected to the outer frame and projected onto the opening center side of the door frame body from the outer frame. The inner side face of the vertical frame 2 of the metal frame is made flush with the inner side face of the outer frame 22o of the resin frame.</p>
申请公布号 JP2003097151(A) 申请公布日期 2003.04.03
申请号 JP20010289066 申请日期 2001.09.21
申请人 SHIN NIKKEI CO LTD 发明人 SATAKE KAZUO;KOJIMA KENJI
分类号 E06B1/52;E05F7/00;E06B1/32;E06B3/00;E06B3/36;(IPC1-7):E06B1/52 主分类号 E06B1/52
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