COMPOSITION FOR FORMING FILM, FORMING METHOD OF FILM AND ORGANIC FILM

摘要

PROBLEM TO BE SOLVED: To obtain a composition for forming a film having a dielectric constant of 3.5 or less, excellent coating elastic modulus and a nonproliferation function of copper, as a layer insulating film material for use in a semiconductor device or the like. SOLUTION: The composition for forming a film is characterized by containing (A) a polymer which is aromatic polyarylene or aromatic polyarylene ether and comprises a structure having a complex forming ability with copper, and (B) an organic solvent.