| 摘要 |
The present invention relates to methods for forming metalized structures, such as electrodes, on non-conductive substrates of electronic and electro-optic devices for enhanced corrosion resistance. In the method of the present invention, an electrode layer is deposited over an adhesion layer on a substrate surface including all edges of the adhesion layer not in contact with the substrate, thereby encapsulating the adhesion layer within the electrode metal before forming the electrode. Prior art multi-layer metalized structures have a galvanic corrosion problem when exposed to moisture, owing to the differences in electrochemical potentials of the dissimilar metals. Galvanic corrosion cells are created at areas of water condensation during device service. Such galvanic corrosion can cause current leakage, short circuit, or other problems causing device failures. By encapsulating all surfaces of the adhesion layer not in contact with the substrate, in accordance with the present invention, galvanic corrosion can be prevented.
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