发明名称 |
Flip chip dip coating encapsulant |
摘要 |
A method for underfilling and encapsulating a flip chip in one step is disclosed. The flip chip is immersed in a polymer bath to apply a coating of the polymer to the surface of the flip chip except for the distal end of the conductive projections on the flip chip electrically conductive pads. The coated flip chip is exposed to ultraviolet light or heat (e.g., IR radiation) to surface cure a skin over the polymer coating. The skin-cured flip chip is placed on a substrate which is then heated to reflow the conductive material from the projections and to cause the polymer from the coating to underfill the flip chip and thermally cure to encapsulate and underfill the flip chip.
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申请公布号 |
US2003062400(A1) |
申请公布日期 |
2003.04.03 |
申请号 |
US20020298337 |
申请日期 |
2002.11.18 |
申请人 |
JOHNSON FARRAH J.;JIANG TONGBI |
发明人 |
JOHNSON FARRAH J.;JIANG TONGBI |
分类号 |
H01L21/283;H01L21/288;H01L21/56;(IPC1-7):B23K31/02 |
主分类号 |
H01L21/283 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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