发明名称 ELECTROLESS GOLD PLATING LIQUID AND ELECTROLESS GOLD PLATING METHOD
摘要 PROBLEM TO BE SOLVED: To provide an electroless gold plating liquid which is non-cyan type and is excellent in stability, and a gold plating method which is excellent in operability and enables the production of a film of excellent property. SOLUTION: In this electroless gold plating liquid comprising a gold salt and a reducing agent, the gold salt is sodium gold sulfide and the reducing agent is one of catechol, pyrogallol, and gallic acid. The composition of plating liquid has preferably a gold salt concentration of 0.002-0.1 mol/L and a reducing agent concentration of 0.01-0.5 mol/L. Further in the gold plating method using this plating liquid, it is preferable that pH of the gold plating liquid is 5-9, the temperature of the gold plating liquid is room temperature to 75 deg.C and the object to be plated is immersed in the gold plating liquid.
申请公布号 JP2003096575(A) 申请公布日期 2003.04.03
申请号 JP20010290777 申请日期 2001.09.25
申请人 TANAKA KIKINZOKU KOGYO KK 发明人 HORIUCHI AIKO;YUASA MAKOTO;OTANI YUTAKA
分类号 C23C18/44;(IPC1-7):C23C18/44 主分类号 C23C18/44
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