发明名称 |
Low inductance multiple resistor EC capacitor pad |
摘要 |
According to the present invention a pad arrangement is provided for applying reworks or engineering changes to an electronic circuits to be formed on the circuit board, the pad arrangement comprising a first signal pad for being electrically connected to a first signal line, a second signal pad for being electrically connected to a second signal line, a ground pad being connected to a ground line provided on the circuit board, and a voltage pad being connected to a supply voltage line provided on the circuit board, whereby the pads are arranged in proximity to each other for facilitating a placement of electronic devices between at least two of the pads.
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申请公布号 |
US2003063447(A1) |
申请公布日期 |
2003.04.03 |
申请号 |
US20020261304 |
申请日期 |
2002.09.30 |
申请人 |
INTERNATIONAL BUSINESS MACHINES CORPORATION |
发明人 |
CWIK MANFRED;PROSS HARALD;SCHROTTENHOLZER RENE FRANK |
分类号 |
H05K1/00;H05K1/11;H05K3/22;H05K7/10;(IPC1-7):H05K7/10;H05K7/12 |
主分类号 |
H05K1/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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