| 摘要 |
<p>A semiconductor wafer end face polishing machine capable of polishing the end face of a semiconductor wafer easily in a short time and also changing a polishing tool in a short time, comprising a polishing head having a drive roller (33), a drive means (36) for rotating the drive roller, upper and lower rollers (34, 35) disposed forward of and parallel with the drive roller in vertical direction, an endless belt (B) for polishing applied onto the rollers, and vertically movable tensing rollers (41, 42) for tensing the endless belt for polishing.</p> |
