发明名称 |
WIRING SUBSTRATE, METHOD OF MANUFACTURING THE SAME, AND ELECTRONIC COMPONENT |
摘要 |
PURPOSE: To solve the problem wherein a bonding agent is crowed out from a conductive land when an electronic component mounted on the conductive land using a conductive bonding material having viscosity is reduced in size. CONSTITUTION: On the main surface of an insulation substrate 11, a wiring substrate 10 includes the conductive land 12 formed thicker in the peripheral area than the central area, and an electronic component 14 which is electrically mounted on the central area of the conductive land 12 via a conducive bonding material 15. |
申请公布号 |
KR20030026855(A) |
申请公布日期 |
2003.04.03 |
申请号 |
KR20020056450 |
申请日期 |
2002.09.17 |
申请人 |
NEC ELECTRONICS CORPORATION |
发明人 |
IKEGAMI GOROU;HIRAI TARO |
分类号 |
C25D5/02;C23C28/00;C25D7/00;H01L23/12;H01L23/498;H05K1/11;H05K1/18;H05K3/06;H05K3/10;H05K3/18;H05K3/34;H05K3/42 |
主分类号 |
C25D5/02 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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