| 摘要 |
PROBLEM TO BE SOLVED: To provide an epoxy resin composition excellent in adhesiveness, flame retardancy and soldering stress resistance. SOLUTION: The semiconductor sealing epoxy resin composition essentially comprises (A) an epoxy resin represented by general formula (1), (B) a phenol resin represented by general formula (2), (C) total inorganic materials, (D) a curing accelerator, and (E) N,N-dicyclohexyl-2-benzotiazolyl sulfanamide, wherein the total inorganic materials are included in 84-94 wt.% in the total epoxy resin composition; N,N-dicyclohexyl-2-benzotiazolyl sulfanamide is included in 0.01-0.1 wt.% in the total epoxy resin composition; and a bromine atom and an antimony atom are included in 0.05 wt.% or less in the total epoxy resin composition, respectively.
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