摘要 |
This invention relates to method of potting a component, namely encasing a component (110) in a potting compound (112) with, optionally, all or some of the voids in the component also being filled with potting compound. In particular, the present invention relates to potting a component that will be subject to high electric field strengths in use. The method comprises introducing an inert gas into a first pressure vessel (100) containing the component to be potted thereby to create an inert environment, introducing a potting compound into the first pressure vessel and allowing the potting compound to cure in the inert environment. |
申请人 |
BAE SYSTEMS PLC;GARNER, PAUL, ANTHONY, JAMES;MOORE, IAN, ANTHONY |
发明人 |
GARNER, PAUL, ANTHONY, JAMES;MOORE, IAN, ANTHONY |