| 摘要 |
This invention provides a protection film bonding method and a protection film bonding apparatus, capable of improving productivity for an operation for bonding the protection film onto one surface of a silicon wafer. A carrier film 19 is separated from a three-layer film H3 having a reinforcement film 3 and the carrier film 19 provided on front and rear surfaces of a protection film 2, respectively, to provide a two-layer film H2. This two-layer film H2 is bonded onto the front surface of the silicon wafer 1, the reinforcement film 3 is peeled off from the two-layer film H2 and then the protection film 2 is trimmed. An apparatus used for this method consists of a supply unit B supplying the three-layer film H3, a separation and take-up unit C separating the carrier film 19 from the three-layer film H3, an assigning and separation unit D assigning the two-layer film H2 onto the silicon wafer 1, a joint unit E joining the two-layer film H2 onto the silicon wafer 1, a peel-off unit F taking up the reinforcement film 3 while separating the reinforcement film 3 from the two-layer film H2, and the like. |
