| 摘要 |
PROBLEM TO BE SOLVED: To provide a novel treatment method in which a joining part of an insulating coating can be peeled off with a simple method and solder joining can be easily conducted after that, and to provide a device therefor. SOLUTION: The solder joining treatment method and the device therefor are characterized by the following process. A prescribed area of an insulation- coated conductor W treated for heat absorption is irradiated with light. When the prescribed area irradiated with light comes in a molten state, a gas jet is blown toward the area in the molten state, and after that, the insulation- coated part is removed to expose the conductor of that part. At the same time, this area is supplied with solder to form a treated state by solder junction. |
