发明名称 |
ELECTROLESS PLATINUM-RHODIUM ALLOY PLATING |
摘要 |
The present invention relates to electroless plating of a platinum-rhodium alloy onto a substrate. More particularly, this invention pertains to an aqueous platinum and rhodium plating bath, a process for plating a uniform coating of a platinum-rhodium alloy onto various substrates using an electroless plating composition, and a platinum-rhodium plated article formed therefrom. This process is suitable for the deposition of a platinum-rhodium alloy on virtually any material of any geometrical shape, including fibers and powders. |
申请公布号 |
EP1297198(A2) |
申请公布日期 |
2003.04.02 |
申请号 |
EP20010953413 |
申请日期 |
2001.07.05 |
申请人 |
HONEYWELL INTERNATIONAL INC. |
发明人 |
KOZLOV, ALEXANDER, S.;NARASIMHAN, DAVE;PALANISAMY, THIRUMALAI |
分类号 |
C23C18/44;C23C18/48;H05K3/24;(IPC1-7):C23C18/48 |
主分类号 |
C23C18/44 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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