System and method for electroplating fine geometries

摘要

An electroplating system 10 is described which provides for the formation of a conductive layer on a workpiece 12. The current used to electroplate the workpiece 12 is controlled by a controller 26. The rotation of the workpiece within a solution containing conductive material is controlled by a rotation controller 22. The current level and/or rotation of the workpiece is controlled in such a way that the non-uniform growth of large grains within the conductive film is minimized.