发明名称 |
Chromium adhesion layer for copper vias in low-k technology |
摘要 |
In integrated circuits having copper interconnect and low-k interlayer dielectrics, a problem of open circuits after heat treatment was discovered and solved by the use of a first liner layer of Cr, followed by a conformal liner layer of CVD TiN, followed in turn by a final liner layer of Ta or TaN, thus improving adhesion between the via and the underlying copper layer while maintaining low resistance.
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申请公布号 |
US6539625(B2) |
申请公布日期 |
2003.04.01 |
申请号 |
US20010759017 |
申请日期 |
2001.01.11 |
申请人 |
INTERNATIONAL BUSINESS MACHINES CORPORATION;INFINEON TECHNOLOGIES AG |
发明人 |
ENGEL BRETT H.;HOINKIS MARK;MILLER JOHN A.;SEO SOON-CHEON;WANG YUN-YU;WONG KWONG HON |
分类号 |
H01K3/10;H01L21/3205;H01L21/768;H01L23/50;H01L23/52;H01L23/532;H05K3/02;(IPC1-7):H05K3/02 |
主分类号 |
H01K3/10 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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