发明名称 |
Resin-sealed semiconductor device and method of manufacturing the device |
摘要 |
A resin-sealed semiconductor device according to this invention is an LOC type semiconductor device comprising a semiconductor chip having a circuit surface on which an electrode is formed; a lead which is arranged in such a manner that the distal end of the lead overlaps the semiconductor chip, and which is electrically connected to each electrode; a lead fixing resin layer interposed between the semiconductor chip and the lead to fix them; and a sealing resin layer coated to cover the semiconductor chip and the lead. The diameter of filler contained in the lead fixing resin layer is about 1/10 to 1/5 the diameter of filler contained in the sealing resin layer, and is about 1/10 a gap between the lead and the semiconductor chip.
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申请公布号 |
US6541306(B2) |
申请公布日期 |
2003.04.01 |
申请号 |
US20010875258 |
申请日期 |
2001.06.07 |
申请人 |
OKI ELECTRIC INDUSTRY CO., LTD. |
发明人 |
OHUCHI SHINJI;ANZAI NORITAKA |
分类号 |
H01L23/29;H01L23/31;H01L23/495;(IPC1-7):H01L21/44 |
主分类号 |
H01L23/29 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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