发明名称 |
Inherently robust repair process for thin film circuitry using uv laser |
摘要 |
A multilayer thin film structure having defined strap repair lines thereon and a method for repairing interconnections in the multilayer thin film structure (MLTF) and/or making engineering changes (EC) are provided. The method determines interconnection defects in the MLTF at a thin film layer adjacent the top metal layer of the structure, defines the top surface metallization including a series of orthogonal X conductor lines and Y conductor lines using photoresist and lithography and additive or subtractive metallization techniques and then uses a phototool to selectively expose the photoresist to define top surface strap connections needed to repair the interconnections and/or make EC's, and forms the top surface metallization. |
申请公布号 |
US6541709(B1) |
申请公布日期 |
2003.04.01 |
申请号 |
US19960743405 |
申请日期 |
1996.11.01 |
申请人 |
INTERNATIONAL BUSINESS MACHINES CORPORATION |
发明人 |
FRANKLIN PETER A.;MERRYMAN ARTHUR G.;PATEL RAJESH S.;WASSICK THOMAS A. |
分类号 |
H01L21/48;H01L23/498;H01L23/538;H05K3/22;(IPC1-7):H05K1/03 |
主分类号 |
H01L21/48 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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