| 摘要 |
A FPC board 400 is manufactured by patterning copper foils which are bonded onto both sides of a base film 410 having insulation and flexibility without an adhesive layer, and forming an input wiring 420a and an output wiring 420b on a mounting surface of an electronic component while forming a dummy wiring layer 422 on the surface opposite the mounting surface. A dummy wiring layer 422 is set to be slightly larger than an area where an IC chip 450 is mounted, and has moisture resistance and light shielding properties. An input electrode 450a of the IC chip 450 is electrically connected to the input wiring 420a and an output electrode 450b is electrically connected to the output wiring 420b through electrically conductive particles 460a dispersed into an adhesive agent 460, such as an epoxy resin, at an appropriate ratio, and the adhesive agent 460 encapsulates the connection regions. |
