发明名称 |
Porous dielectric material and electronic devices fabricated therewith |
摘要 |
A novel dielectric composition is provided that is useful in the manufacture of electronic devices such as integrated circuit devices and integrated circuit packaging devices. The dielectric composition is prepared by crosslinking a thermally decomposable porogen to a host polymer via a coupling agent, followed by heating to a temperature suitable to decompose the porogen. The porous materials that result have dielectric constants less than about 3.0, with some materials having dielectric constants less than about 2.5. Integrated circuit devices, integrated circuit packaging devices, and methods of manufacture are provided as well.
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申请公布号 |
US6541865(B2) |
申请公布日期 |
2003.04.01 |
申请号 |
US20010892234 |
申请日期 |
2001.06.26 |
申请人 |
INTERNATIONAL BUSINESS MACHINES CORPORATION |
发明人 |
HAWKER CRAIG JON;HEDRICK JAMES L.;MILLER ROBERT D.;VOLKSEN WILLI |
分类号 |
H01L21/316;H01L21/768;H01L23/498;H01L23/522;H01L23/532;H05K1/02;H05K3/28;(IPC1-7):H01L23/52 |
主分类号 |
H01L21/316 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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