发明名称 |
Sub chip on board for optical mouse |
摘要 |
A sub chip on board for an optical mouse is disclosed. The chip on board has a sub PCB having both a plurality of input/output pads and a plurality of pin holes. A sensor die has an optical sensor wire-bonded to said input/output pads for sensing received light, and is attached to a bottom surface of the sub PCB. A transparent resin covers the sensor die at the bottom surface of the sub PCB. A cap is attached to the bottom surface of the sub PCB such that the cap covers the transparent resin, and has a hole for guiding the received light to said optical sensor. A main PCB has both a hole for guiding the received light to the optical sensor and a plurality of pin holes corresponding to the pin holes of the sub PCB. A plurality of pins are commonly inserted into the pin holes of both the main PCB and the sub PCB.
|
申请公布号 |
US6541762(B2) |
申请公布日期 |
2003.04.01 |
申请号 |
US20010984283 |
申请日期 |
2001.10.29 |
申请人 |
SAMSUNG ELECTRO-MECHANICS CO., LTD. |
发明人 |
KANG DONG-HOON;PAIK JOON-KI |
分类号 |
G06F3/03;G06F3/033;H05K1/02;H05K1/14;H05K3/34;(IPC1-7):H01J40/14;H01J5/02 |
主分类号 |
G06F3/03 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|