发明名称 |
Compression-bond-connection substrate, liquid crystal device, and electronic equipment |
摘要 |
A compression-bond-connection substrate compression-bonded to a compression-bonding target object has front-side terminals conductively connected to opposing-side terminals and backside terminals formed at the backsides thereof. The backside terminals are formed diagonally to the front-side terminals. Pressure is exerted uniformly on substrate-side terminals in the pressure application in compression-bonding. Therefore, a highly reliable compression-bonding connected assembly can be stably obtained.
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申请公布号 |
US6542213(B1) |
申请公布日期 |
2003.04.01 |
申请号 |
US19990445010 |
申请日期 |
1999.11.30 |
申请人 |
SEIKO EPSON CORPORATION |
发明人 |
UCHIYAMA KENJI |
分类号 |
G02F1/13;H05K1/02;H05K1/11;H05K3/32;H05K3/36;(IPC1-7):G02F1/134 |
主分类号 |
G02F1/13 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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