| 摘要 |
A heat sink mounting structure which can increase a cooling efficiency and easily mount a heat sink. The heat sink mounting structure includes an integrated circuit package, a heat sink mounted on the integrated circuit package, and a fastener for fastening the heat sink to the integrated circuit package so that a lower surface of the heat sink comes into close contact with an upper surface of the integrated circuit package. The fastener includes a strip member, a pair of forked members integrally connected to opposite ends of the strip member, and a pair of engaging members integrally connected to the pair of forked members. The engaging members are adapted to engage diagonal corner portions of the integrated circuit package, and the forked members are adapted to come into pressure contact with side surfaces of the heat sink. |
