SEALING STRUCTURE FOR HIGHLY MOISTURE-SENSITIVE ELECTRONIC DEVICE ELEMENT AND FABRICATING METHOD THEREOF

摘要

PURPOSE: A sealing structure for a highly moisture-sensitive electronic device element is provided to prevent early breakdown of the electronic device caused by moisture and early deterioration of the capacity of the electronic device by including an encapsulation enclosure and a sealing material located between a substrate and the encapsulation enclosure. CONSTITUTION: The encapsulation enclosure(30) encapsulates all of the highly moisture-sensitive electronic devices(12) on the substrate(10). The sealing material(20) is positioned between the substrate and the encapsulation enclosure to form a partial seal(later to be filled) between the substrate and the encapsulation enclosure around each highly moisture-sensitive electronic device or around groups of highly moisture-sensitive electronic devices.