发明名称 |
DRY ETCH APPARATUS FOR FABRICATING SEMICONDUCTOR DEVICE AND COVER RING OF THE SAME |
摘要 |
PURPOSE: A dry etch apparatus for fabricating a semiconductor device and a cover ring of the same are provided to lengthen an exchanging period of the cover ring by preventing an etching phenomenon of the cover ring in a plasma state. CONSTITUTION: A cooling plate(14) is formed at a lower portion of an upper structure(10). The cooling plate(14) is used for controlling the temperature of an upper electrode(12). A shield ring(16) is installed at a side portion of the upper electrode(12). An outer ring(18) is installed at a side portion of the shield ring(16). A center ring(20) is installed at a side portion of the outer ring(18). An electrical spin chuck is installed on an upper surface of a lower electrode(22). A wafer(28) is loaded on the electrical spin chuck. A holder ring(24) is installed at a side portion of the lower electrode(22). A base ring(26) is installed at a side portion of the holder ring(24). A focus ring(30) is installed at an edge of the lower electrode(22). A cover ring(32) is installed at a side portion of the focus ring(30). A bellows ring(34) is installed at a lower portion of the lower electrode(22).
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申请公布号 |
KR20030025566(A) |
申请公布日期 |
2003.03.29 |
申请号 |
KR20010058674 |
申请日期 |
2001.09.21 |
申请人 |
SAMSUNG ELECTRONICS CO., LTD. |
发明人 |
JUN, SANG JUN |
分类号 |
H01L21/3065;(IPC1-7):H01L21/306 |
主分类号 |
H01L21/3065 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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